Epoxy adhesive is one of the most widely used reactive adhesives, especially for critical structural bonding applications requiring high adhesion and reliability performance. Epoxy adhesives show good adhesion to a wide range of materials such as metals, glass, concrete, ceramics, wood, and many plastics. Curing shrinkage is very low. Cured epoxy resin possesses strong and rigid cross-linked chemical structure. Epoxy adhesives usually need relatively long cure time, ranging from several days at room temperature to at least tens of minutes at elevated temperature. In recent years, several new types of epoxy adhesives that can bond substrates instantly have been successfully developed and applied to meet high production efficiency required applications, especially in semiconductor packaging and electronics device assembly industry. These new epoxy adhesives can bond different substrates instantly within a few seconds at the specified curing conditions while still possess satisfactory adhesion and reliability performance as structural epoxy adhesives after full cure. UV cationic epoxy adhesives, primarily composed of epoxy resin and cationic photo initiator, have been developed and commercialized for use in optical parts bonding, camera module sensor packaging and OLED panel assembly applications. Dual cure hybrid epoxy adhesives have been developed with combination of UV cure acrylate with thermal cure epoxy composition and commercialized for use in LCD panel assembly and camera module sensor packaging applications. Snap thermal cure epoxy adhesives are typically one-component epoxy compositions formulated from epoxy resin, latent curing agent and functional fillers. Snap thermal cure epoxy adhesives can cure at certain high temperature with a press, for a few seconds and have been commercialized as anisotropic conductive adhesives (ACAs) including anisotropic conductive film (ACF) and anisotropic conductive paste (ACP) to bond and connect the driver electronics with the glass substrates in electronics device assembly. Successful development of these new type instant bonding epoxy technology has greatly contributed to semiconductor packaging and electronics device assembly industry revolution that have made a big impact on our ordinary life.

Dr. Chunfu Chen is currently Senior Scientific Principal Epoxy of Henkel Adhesive Technologies, the world’s number one producer in adhesives, sealants, and functional coatings. He is responsible for new adhesive product development, new epoxy technology research, and providing technical advice as the leading expert to corporate internal teams and external partners especially related to epoxy adhesive technology. Dr. Chen is based at Henkel Technology Center – Asia Pacific, located in Yokohama, Japan. 

He has abundant research experience, with over 35 years, in polymer science and material areas especially on epoxy adhesive technology. His technical expertise lies in the areas of new product development and new technology research, ranging from room temperature cure epoxy adhesives, heat cure epoxy adhesives, light cure epoxy adhesives, and light cure acrylic adhesives as well as latent curing agent for epoxy resin. Dr. Chen has contributed to very successful development on various new adhesive products for electronic assemblies such as camera module bonding, LCD ODF panel sealing, display module assembly, and touch panel LOCA. He has also contributed to successful development on many new adhesive products for general industry applications such as general manufacturing structural bonding, maintenance and repair protective coating. 

D. Chen received his Bachelor of Science in Chemistry in 1985 and his Ph.D. in Polymer Chemistry in 1990 from Nankai University in Tianjin, China.  After completing his Ph.D., he became Assistant Professor at Nankai University and had been a visiting researcher for 1 and half year from 1991 to 1993 at Sophia University in Tokyo, Japan. Dr. Chen has invented 37 patents with 22 granted already. He has also published more than 40 international conference, research, and review articles. Recently Dr. Chen has authored a new scientific book ‘Instant Bonding Epoxy Technology’, to be published soon by Bentham Science.